Cu Multilevel Metallization in ULSI Circuits
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 강상원 | - |
| dc.date.accessioned | 2013-03-15T16:46:43Z | - |
| dc.date.available | 2013-03-15T16:46:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1997 | - |
| dc.identifier.citation | 제4회 한국반도체학술대회 논문집, v., no., pp.387 - 389 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/121475 | - |
| dc.language | KOR | - |
| dc.title | Cu Multilevel Metallization in ULSI Circuits | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 387 | - |
| dc.citation.endingpage | 389 | - |
| dc.citation.publicationname | 제4회 한국반도체학술대회 논문집 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 강상원 | - |
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