Electroplating을 이용한 Eutectic Pb/Sn Solder Bump 제작과 Solder/UBM (Under Bump Metallurgy)간 계면 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung Wook | - |
| dc.date.accessioned | 2013-03-15T16:30:35Z | - |
| dc.date.available | 2013-03-15T16:30:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-02-01 | - |
| dc.identifier.citation | 제5회 한국반도체 학술대회, v., no., pp.589 - 590 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/121320 | - |
| dc.language | KOR | - |
| dc.publisher | 한국반도체 학술대회 | - |
| dc.title | Electroplating을 이용한 Eutectic Pb/Sn Solder Bump 제작과 Solder/UBM (Under Bump Metallurgy)간 계면 연구 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 589 | - |
| dc.citation.endingpage | 590 | - |
| dc.citation.publicationname | 제5회 한국반도체 학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
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