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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Electroplating을 이용한 Eutectic Pb/Sn Solder Bump 제작과 Solder/UBM (Under Bump Metallurgy)간 계면 연구

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Paik, Kyung Wookresearcher
Publisher
한국반도체 학술대회
Issue Date
1998-02-01
Language
KOR
Citation

제5회 한국반도체 학술대회, pp.589 - 590

URI
http://hdl.handle.net/10203/121320
Appears in Collection
MS-Conference Papers(학술회의논문)
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