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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Alloy Design of Sn-Ag-Bi-Sb Solder System Using Thermodynamic Calculations

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dc.contributor.authorLee, Hyuck Mo-
dc.contributor.authorLee, BJ-
dc.date.accessioned2013-03-15T14:53:51Z-
dc.date.available2013-03-15T14:53:51Z-
dc.date.created2012-02-06-
dc.date.issued1997-02-11-
dc.identifier.citation1997 TMS Annual Meeting, v., no., pp.129 - 136-
dc.identifier.urihttp://hdl.handle.net/10203/120462-
dc.languageENG-
dc.titleAlloy Design of Sn-Ag-Bi-Sb Solder System Using Thermodynamic Calculations-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage129-
dc.citation.endingpage136-
dc.citation.publicationname1997 TMS Annual Meeting-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorLee, BJ-
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MS-Conference Papers(학술회의논문)
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