DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Hyuck Mo | - |
dc.contributor.author | Lee, BJ | - |
dc.date.accessioned | 2013-03-15T14:53:51Z | - |
dc.date.available | 2013-03-15T14:53:51Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1997-02-11 | - |
dc.identifier.citation | 1997 TMS Annual Meeting, v., no., pp.129 - 136 | - |
dc.identifier.uri | http://hdl.handle.net/10203/120462 | - |
dc.language | ENG | - |
dc.title | Alloy Design of Sn-Ag-Bi-Sb Solder System Using Thermodynamic Calculations | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 129 | - |
dc.citation.endingpage | 136 | - |
dc.citation.publicationname | 1997 TMS Annual Meeting | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Hyuck Mo | - |
dc.contributor.nonIdAuthor | Lee, BJ | - |
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