Studies on thin film integral passive components for mixed mode multichip module (MCM) applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-15T12:44:31Z | - |
| dc.date.available | 2013-03-15T12:44:31Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1995-12-04 | - |
| dc.identifier.citation | Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, v., no., pp.365 - 368 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/119563 | - |
| dc.language | ENG | - |
| dc.title | Studies on thin film integral passive components for mixed mode multichip module (MCM) applications | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-0029454037 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 365 | - |
| dc.citation.endingpage | 368 | - |
| dc.citation.publicationname | Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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