Design and strength evaluation of an anodically bonded pressurized cavity array for wafer-level MEMS packaging
- Issue Date
- 1998-11-15
- Language
- ENG
- Citation
Inter. Mechanical Engineering Congress and Exposition (IMECE '98),, v.66, pp.357 - 360
- Appears in Collection
- BiS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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