Design and strength evaluation of an anodically bonded pressurized cavity array for wafer-level MEMS packaging

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 438
  • Download : 0
Issue Date
1998-11-15
Language
ENG
Citation

Inter. Mechanical Engineering Congress and Exposition (IMECE '98),, v.66, pp.357 - 360

URI
http://hdl.handle.net/10203/119556
Appears in Collection
BiS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0