Projection Moire for 3D Inspection of Printed Circuit Boards

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dc.contributor.authorKim, Seung-Woo-
dc.contributor.authorChoi, YB-
dc.contributor.authorOh, JT-
dc.date.accessioned2013-03-15T12:04:40Z-
dc.date.available2013-03-15T12:04:40Z-
dc.date.created2012-02-06-
dc.date.issued1997-
dc.identifier.citationSPIE, v., no., pp.129 - 138-
dc.identifier.urihttp://hdl.handle.net/10203/119305-
dc.languageENG-
dc.titleProjection Moire for 3D Inspection of Printed Circuit Boards-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage129-
dc.citation.endingpage138-
dc.citation.publicationnameSPIE-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Seung-Woo-
dc.contributor.nonIdAuthorChoi, YB-
dc.contributor.nonIdAuthorOh, JT-
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ME-Conference Papers(학술회의논문)
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