반도체 패키지용 입자강화 에폭시 수지에 대한 열응력 해석Thermal stress analysis of EMC in QFP electronic package

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Publisher
대한기계학회
Issue Date
1997-04
Language
KOR
Citation

대한기계학회 1997년 춘계학술대회, v.1, no.1, pp.771 - 777

URI
http://hdl.handle.net/10203/118897
Appears in Collection
ME-Conference Papers(학술회의논문)
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