반도체 패키지용 입자강화 에폭시 수지에 대한 열응력 해석Thermal stress analysis of EMC in QFP electronic package
- Publisher
- 대한기계학회
- Issue Date
- 1997-04
- Language
- KOR
- Citation
대한기계학회 1997년 춘계학술대회, v.1, no.1, pp.771 - 777
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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