Anisotropic conductive film (ACF) interconnection for display packaging applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yim, Myung-Jin | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Kim, Tae-Sung | ko |
| dc.contributor.author | Kim, Yang-Kook | ko |
| dc.date.accessioned | 2013-03-15T10:52:08Z | - |
| dc.date.available | 2013-03-15T10:52:08Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-05-25 | - |
| dc.identifier.citation | Proceedings of the 1998 48th Electronic Components & Technology Conference, pp.1036 - 1041 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/118798 | - |
| dc.language | English | - |
| dc.publisher | Electronic Components & Technology Conference | - |
| dc.title | Anisotropic conductive film (ACF) interconnection for display packaging applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000074438800163 | - |
| dc.identifier.scopusid | 2-s2.0-0031620186 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1036 | - |
| dc.citation.endingpage | 1041 | - |
| dc.citation.publicationname | Proceedings of the 1998 48th Electronic Components & Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Seattle, WA, USA | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yim, Myung-Jin | - |
| dc.contributor.nonIdAuthor | Kim, Tae-Sung | - |
| dc.contributor.nonIdAuthor | Kim, Yang-Kook | - |
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