Squeeze Casting Process and Thermal Properties of High Volume Fraction SiCp/Al Metal Matrix Composites for Electronic Packaging Applications

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Publisher
한국복합재료학회
Issue Date
1998-01-01
Language
KOR
Citation

Fall Meeting of the Korean Society for Composite Materials

URI
http://hdl.handle.net/10203/118388
Appears in Collection
MS-Conference Papers(학술회의논문)
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