MOCVD 법에 의한 Cu 박막의 증착속도 및 증착두께 분포Deposition Rate and Thickness Distribution of Cu Film by MOCVD Process

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Issue Date
1995-04
Language
KOR
Citation

KIChE Spring Meeting, pp.844 - 847

URI
http://hdl.handle.net/10203/117933
Appears in Collection
CBE-Conference Papers(학술회의논문)
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