MOCVD 법에 의한 Cu 박막의 증착속도 및 증착두께 분포Deposition Rate and Thickness Distribution of Cu Film by MOCVD Process

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 335
  • Download : 0
Issue Date
1995-04
Language
KOR
Citation

KIChE Spring Meeting, pp.844 - 847

URI
http://hdl.handle.net/10203/117933
Appears in Collection
CBE-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0