Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | - |
| dc.date.accessioned | 2013-03-15T08:32:41Z | - |
| dc.date.available | 2013-03-15T08:32:41Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-11-01 | - |
| dc.identifier.citation | 한국재료학회 추계학술대회, v., no., pp.81 - 81 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117891 | - |
| dc.language | KOR | - |
| dc.publisher | 한국재료학회 | - |
| dc.title | Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 81 | - |
| dc.citation.endingpage | 81 | - |
| dc.citation.publicationname | 한국재료학회 추계학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
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