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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

New reflow process for indium bump

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dc.contributor.authorKim, Y.-H.-
dc.contributor.authorChoi, J.-H.-
dc.contributor.authorChoi, K.-S.-
dc.contributor.authorLee, Hee Chul-
dc.contributor.authorKim, Choong Ki-
dc.date.accessioned2013-03-15T08:25:00Z-
dc.date.available2013-03-15T08:25:00Z-
dc.date.created2012-02-06-
dc.date.issued1997-04-20-
dc.identifier.citationInfrared Technology and Applications XXIII, v.3061, no., pp.60 - 67-
dc.identifier.urihttp://hdl.handle.net/10203/117827-
dc.languageENG-
dc.titleNew reflow process for indium bump-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0346862768-
dc.type.rimsCONF-
dc.citation.volume3061-
dc.citation.beginningpage60-
dc.citation.endingpage67-
dc.citation.publicationnameInfrared Technology and Applications XXIII-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Hee Chul-
dc.contributor.localauthorKim, Choong Ki-
dc.contributor.nonIdAuthorKim, Y.-H.-
dc.contributor.nonIdAuthorChoi, J.-H.-
dc.contributor.nonIdAuthorChoi, K.-S.-
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EE-Conference Papers(학술회의논문)
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