The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-15T08:23:54Z | - |
| dc.date.available | 2013-03-15T08:23:54Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1997-02-01 | - |
| dc.identifier.citation | 2nd Pan Pacific Microelectronics Symposium, v., no., pp.233 - 239 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117820 | - |
| dc.language | ENG | - |
| dc.title | The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 233 | - |
| dc.citation.endingpage | 239 | - |
| dc.citation.publicationname | 2nd Pan Pacific Microelectronics Symposium | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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