멀티칩 모듈 기술
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | - |
| dc.date.accessioned | 2013-03-15T07:53:47Z | - |
| dc.date.available | 2013-03-15T07:53:47Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1996-08-01 | - |
| dc.identifier.citation | 재료 및 파괴부문 학술대회, v., no., pp.74 - 81 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117593 | - |
| dc.language | KOR | - |
| dc.publisher | 재료 및 파괴부문 학술대회 | - |
| dc.title | 멀티칩 모듈 기술 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 74 | - |
| dc.citation.endingpage | 81 | - |
| dc.citation.publicationname | 재료 및 파괴부문 학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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