Combined analysis of moisture diffusion with interface fracture mechanics on the interface delamination in the plastic IC packages during reflow soldering
- Issue Date
- 1998-04-14
- Language
- ENG
- Citation
Proceedings of the 1998 MRS Spring Symposium, v.515, pp.31 - 36
- ISSN
- 0272-9172
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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