Novel 3-Dimensional Memory Stack Package Using Polymer Insulated Sidewall

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 206
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-15T06:56:24Z-
dc.date.available2013-03-15T06:56:24Z-
dc.date.created2012-02-06-
dc.date.issued1998-03-01-
dc.identifier.citationInternational Conference on Electronic Materials, v., no., pp.97 - 97-
dc.identifier.urihttp://hdl.handle.net/10203/117138-
dc.languageENG-
dc.titleNovel 3-Dimensional Memory Stack Package Using Polymer Insulated Sidewall-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage97-
dc.citation.endingpage97-
dc.citation.publicationnameInternational Conference on Electronic Materials-
dc.contributor.localauthorPaik, Kyung-Wook-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0