Adhesion reliability of Cu-Cr alloy films to polyimide
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ahn, EC | ko |
| dc.contributor.author | Yu, Jin | ko |
| dc.contributor.author | Oh, TC | ko |
| dc.contributor.author | Park, IS | ko |
| dc.date.accessioned | 2013-03-15T05:45:34Z | - |
| dc.date.available | 2013-03-15T05:45:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1996-04-08 | - |
| dc.identifier.citation | Proceedings of the 1996 MRS Spring Symposium, pp.67 - 71 | - |
| dc.identifier.issn | 0272-9172 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/116765 | - |
| dc.language | English | - |
| dc.publisher | MRS | - |
| dc.title | Adhesion reliability of Cu-Cr alloy films to polyimide | - |
| dc.type | Conference | - |
| dc.identifier.wosid | A1996BG72C00017 | - |
| dc.identifier.scopusid | 2-s2.0-0030385734 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 67 | - |
| dc.citation.endingpage | 71 | - |
| dc.citation.publicationname | Proceedings of the 1996 MRS Spring Symposium | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Francisco, CA, USA | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Ahn, EC | - |
| dc.contributor.nonIdAuthor | Oh, TC | - |
| dc.contributor.nonIdAuthor | Park, IS | - |
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