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College of Engineering(공과대학)Dept. of Bio and Brain Engineering(바이오및뇌공학과)BiS-Conference Papers(학술회의논문)

Measurement of Young's Modulus and Residual Stress in E-Beam Evaporated Aluminum and Thermally Evaporated Chromium Films using Blister Method

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dc.contributor.authorMoon, HJ-
dc.contributor.authorEarmme, Youn-Young-
dc.contributor.authorPark, SS-
dc.contributor.authorCho, Young-Ho-
dc.date.accessioned2013-03-15T03:50:45Z-
dc.date.available2013-03-15T03:50:45Z-
dc.date.created2012-02-06-
dc.date.issued1996-06-10-
dc.identifier.citationProc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, v., no., pp.5 - 6-
dc.identifier.urihttp://hdl.handle.net/10203/116166-
dc.languageENG-
dc.titleMeasurement of Young's Modulus and Residual Stress in E-Beam Evaporated Aluminum and Thermally Evaporated Chromium Films using Blister Method-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage5-
dc.citation.endingpage6-
dc.citation.publicationnameProc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorEarmme, Youn-Young-
dc.contributor.localauthorCho, Young-Ho-
dc.contributor.nonIdAuthorMoon, HJ-
dc.contributor.nonIdAuthorPark, SS-
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ME-Conference Papers(학술회의논문)BiS-Conference Papers(학술회의논문)
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