DC Field | Value | Language |
---|---|---|
dc.contributor.author | Moon, HJ | - |
dc.contributor.author | Earmme, Youn-Young | - |
dc.contributor.author | Park, SS | - |
dc.contributor.author | Cho, Young-Ho | - |
dc.date.accessioned | 2013-03-15T03:50:45Z | - |
dc.date.available | 2013-03-15T03:50:45Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996-06-10 | - |
dc.identifier.citation | Proc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, v., no., pp.5 - 6 | - |
dc.identifier.uri | http://hdl.handle.net/10203/116166 | - |
dc.language | ENG | - |
dc.title | Measurement of Young's Modulus and Residual Stress in E-Beam Evaporated Aluminum and Thermally Evaporated Chromium Films using Blister Method | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 5 | - |
dc.citation.endingpage | 6 | - |
dc.citation.publicationname | Proc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Earmme, Youn-Young | - |
dc.contributor.localauthor | Cho, Young-Ho | - |
dc.contributor.nonIdAuthor | Moon, HJ | - |
dc.contributor.nonIdAuthor | Park, SS | - |
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