Measurement of Young's Modulus and Residual Stress in E-Beam Evaporated Aluminum and Thermally Evaporated Chromium Films using Blister Method

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Issue Date
1996-06-10
Language
ENG
Citation

Proc. SEM 8th International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronic Packaging, pp.5 - 6

URI
http://hdl.handle.net/10203/116166
Appears in Collection
ME-Conference Papers(학술회의논문)BiS-Conference Papers(학술회의논문)
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