Modeling and simulation for wafer temperature uniformity in RTP system
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Hyungjin | - |
| dc.contributor.author | Lee, Jeongseok | - |
| dc.contributor.author | Park, Sunwon | - |
| dc.date.accessioned | 2013-03-15T03:30:42Z | - |
| dc.date.available | 2013-03-15T03:30:42Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-10 | - |
| dc.identifier.citation | ChungNam-Kyushu meeting, Fall, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/116060 | - |
| dc.language | ENG | - |
| dc.title | Modeling and simulation for wafer temperature uniformity in RTP system | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | ChungNam-Kyushu meeting, Fall | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Park, Sunwon | - |
| dc.contributor.nonIdAuthor | Park, Hyungjin | - |
| dc.contributor.nonIdAuthor | Lee, Jeongseok | - |
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