Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Mogro-Campero, A | - |
| dc.contributor.author | Turner, L | - |
| dc.date.accessioned | 2013-03-15T01:04:48Z | - |
| dc.date.available | 2013-03-15T01:04:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1994-03-01 | - |
| dc.identifier.citation | 44th ECTC Proceeding, v., no., pp.326 - 336 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/115250 | - |
| dc.language | ENG | - |
| dc.title | Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 326 | - |
| dc.citation.endingpage | 336 | - |
| dc.citation.publicationname | 44th ECTC Proceeding | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Mogro-Campero, A | - |
| dc.contributor.nonIdAuthor | Turner, L | - |
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