The Dynamic Studies on Voids Formation during making in Silicon Wafer Bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 강상원 | - |
| dc.date.accessioned | 2013-03-14T22:27:50Z | - |
| dc.date.available | 2013-03-14T22:27:50Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1992 | - |
| dc.identifier.citation | 한국전자공학회, 합동학술발표회 논문집 제10호, 제1권, v., no., pp.219 - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/114010 | - |
| dc.language | KOR | - |
| dc.title | The Dynamic Studies on Voids Formation during making in Silicon Wafer Bonding | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 219 | - |
| dc.citation.publicationname | 한국전자공학회, 합동학술발표회 논문집 제10호, 제1권 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 강상원 | - |
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