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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Analysis of Fan-induced Convective Heat Transfer Encountered in Electronic Equipment Cooling

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dc.contributor.authorKim, SungJin-
dc.contributor.authorLee, S.W.-
dc.date.accessioned2013-03-14T19:31:08Z-
dc.date.available2013-03-14T19:31:08Z-
dc.date.created2012-02-06-
dc.date.issued1991-
dc.identifier.citationInternational Electronics Packaging Conference, v., no., pp.312 - 325-
dc.identifier.urihttp://hdl.handle.net/10203/112418-
dc.languageENG-
dc.titleAnalysis of Fan-induced Convective Heat Transfer Encountered in Electronic Equipment Cooling-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage312-
dc.citation.endingpage325-
dc.citation.publicationnameInternational Electronics Packaging Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, SungJin-
dc.contributor.nonIdAuthorLee, S.W.-
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ME-Conference Papers(학술회의논문)
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