A Study on the Deposition Characteristics of Copper Films Prepted by LPMOCVD on TiN Barrier Layer

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Publisher
한국재료학회
Issue Date
1993-11
Language
Korean
Citation

한국재료학회 추계학술발표(Korean J. Mat. Sci.), pp.89

URI
http://hdl.handle.net/10203/111564
Appears in Collection
RIMS Conference PapersRIMS Conference Papers
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