The Effect of Deposition Temperature on the Interfacial Properties of SiH4 Reduced Blanket Tungsten on TiN Glue Layer
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 천성순 | ko |
| dc.date.accessioned | 2013-03-14T17:57:35Z | - |
| dc.date.available | 2013-03-14T17:57:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1993-11 | - |
| dc.identifier.citation | 한국재료학회 추계학술발표(Korean J. Mat. Sci.), pp.86 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/111563 | - |
| dc.language | Korean | - |
| dc.publisher | 한국재료학회 | - |
| dc.title | The Effect of Deposition Temperature on the Interfacial Properties of SiH4 Reduced Blanket Tungsten on TiN Glue Layer | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 86 | - |
| dc.citation.publicationname | 한국재료학회 추계학술발표(Korean J. Mat. Sci.) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 연세대학교 | - |
| dc.contributor.localauthor | 천성순 | - |
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