열처리 과정에서의 Lead oxide 와 실리콘 기판과의 상호확산반응Interdiffusion Reaction Between Lead oxide and Silicon Wafer during Heat Treatment

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dc.contributor.author이원규-
dc.contributor.author우성일-
dc.date.accessioned2013-03-14T17:17:22Z-
dc.date.available2013-03-14T17:17:22Z-
dc.date.created2012-02-06-
dc.date.issued1994-10-
dc.identifier.citation한국화학공학회 추계학술발표회, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/111185-
dc.languageENG-
dc.publisher한국화학공학회-
dc.title열처리 과정에서의 Lead oxide 와 실리콘 기판과의 상호확산반응-
dc.title.alternativeInterdiffusion Reaction Between Lead oxide and Silicon Wafer during Heat Treatment-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname한국화학공학회 추계학술발표회-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthor우성일-
dc.contributor.nonIdAuthor이원규-
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CBE-Conference Papers(학술회의논문)
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