A 36 fps SXGA 3-D display processor embedding a programmable 3-D graphics rendering engine

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dc.contributor.authorKim, SHko
dc.contributor.authorYoon, JSko
dc.contributor.authorYu, CHko
dc.contributor.authorKim, Dko
dc.contributor.authorChung, Kko
dc.contributor.authorLim, HSko
dc.contributor.authorLee, YGko
dc.contributor.authorPark, HyunWookko
dc.contributor.authorRa, Jong Beomko
dc.contributor.authorKim, Lee-Supko
dc.date.accessioned2009-09-09T05:49:38Z-
dc.date.available2009-09-09T05:49:38Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-05-
dc.identifier.citationIEEE JOURNAL OF SOLID-STATE CIRCUITS, v.43, pp.1247 - 1259-
dc.identifier.issn0018-9200-
dc.identifier.urihttp://hdl.handle.net/10203/11107-
dc.description.abstractIn this paper, a 3-D display processor embedding a programmable 3-D graphics rendering engine is proposed. The proposed processor combines a 3-D graphics rendering engine and a 3-D image synthesis engine to support both true realism and interactivity for the future multimedia applications. Using high coherence between 3-D graphics data and 3-D display inputs, both pipelines are merged by sharing buffers such that a 3-D display engine directly uses the output of a 3-D graphics rendering engine. The merged architecture has synergetic coupling effects such as freely providing various rendering effects to 3-D images and easily computing disparities without complex extraction processes. In the 3-D image synthesis engine, we adopt view interpolation algorithm and propose real-time synthesis method, pixel-by-pixel process. The view interpolation algorithm reduces the number of images to be rendered, resulting in the reduction of external memory size to 64.8% compared to conventional synthesis process. The proposed pixel-by-pixel process synthesizes 3-D images at 36 fps through bandwidth reduction of 26.7% and decreases internal memory size to 64.2% compared to typical image-by-image process. The 3-D graphics rendering engine is programmable and supports the instruction sets of the latest 3-D graphics standard APIs, Pixel Shader 3.0 and OpenGL|ES 2.0. The die contains about 1.7M transistors, occupies 5 mm x 5 mm in 0.18 mu m CMOS and dissipates 379 mW at 1.85 V.-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleA 36 fps SXGA 3-D display processor embedding a programmable 3-D graphics rendering engine-
dc.typeArticle-
dc.identifier.wosid000255354300020-
dc.identifier.scopusid2-s2.0-42649117171-
dc.type.rimsART-
dc.citation.volume43-
dc.citation.beginningpage1247-
dc.citation.endingpage1259-
dc.citation.publicationnameIEEE JOURNAL OF SOLID-STATE CIRCUITS-
dc.identifier.doi10.1109/JSSC.2008.920315-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPark, HyunWook-
dc.contributor.localauthorRa, Jong Beom-
dc.contributor.localauthorKim, Lee-Sup-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthormultiplexing-
dc.subject.keywordAuthorpixel shader-
dc.subject.keywordAuthorthree-dimensional displays-
dc.subject.keywordAuthorthree-dimensional graphics-
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