Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-14T16:15:30Z | - |
| dc.date.available | 2013-03-14T16:15:30Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1989-03-01 | - |
| dc.identifier.citation | Proc. Mat. Res. Soc. Symp, v., no., pp.21 - 26 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/110642 | - |
| dc.language | ENG | - |
| dc.title | Development of New Ion Beam Modification Techniques to Enhance Copper and Polyimide Adhesion in Multilevel Electronic Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 21 | - |
| dc.citation.endingpage | 26 | - |
| dc.citation.publicationname | Proc. Mat. Res. Soc. Symp | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.