Deposition Characteristics of TiCN Deposited by Plasma Enhanced Chemical Vapor Deposition

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dc.contributor.authorChun , Soung Soonko
dc.date.accessioned2013-03-14T16:12:21Z-
dc.date.available2013-03-14T16:12:21Z-
dc.date.created2012-02-06-
dc.date.issued1989-05-
dc.identifier.citationProc. 7th Int'l Conf. on Ion & Plasma Assisted Techniques, pp.254-
dc.identifier.urihttp://hdl.handle.net/10203/110614-
dc.languageEnglish-
dc.publisherInternational Conference on Ion and Plasma Assisted Techniques-
dc.titleDeposition Characteristics of TiCN Deposited by Plasma Enhanced Chemical Vapor Deposition-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage254-
dc.citation.publicationnameProc. 7th Int'l Conf. on Ion & Plasma Assisted Techniques-
dc.identifier.conferencecountrySZ-
dc.identifier.conferencelocationGeneva, Switzerland-
dc.contributor.localauthorChun , Soung Soon-
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