Performance of a Conduction Cooling Module

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Publisher
American Society of Mechanical Engineers (ASME)
Issue Date
1990-03
Language
ENG
Citation

Journal of Electronic Packaging, v.112, no.1, pp.52 - 56

ISSN
1043-7398
URI
http://hdl.handle.net/10203/11002
Appears in Collection
ME-Conference Papers(학술회의논문)

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