Einfluss des Binder-Burnout Prozesses in der MLC-Technoligic auf die Elektrischen Eingenschaften
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Ho Gi | - |
| dc.date.accessioned | 2013-03-14T14:18:53Z | - |
| dc.date.available | 2013-03-14T14:18:53Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1985 | - |
| dc.identifier.citation | Deutsche Keramische Gesellschaft(DKG) Jahrestagung (West Germany), v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/109617 | - |
| dc.language | ENG | - |
| dc.title | Einfluss des Binder-Burnout Prozesses in der MLC-Technoligic auf die Elektrischen Eingenschaften | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Deutsche Keramische Gesellschaft(DKG) Jahrestagung (West Germany) | - |
| dc.contributor.localauthor | Kim, Ho Gi | - |
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