반도체 소자용 자동 Die Bonding System의 개발
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 변증남 | - |
| dc.contributor.author | 오상록 | - |
| dc.contributor.author | 김재옥 | - |
| dc.contributor.author | 안태영 | - |
| dc.contributor.author | 유범재 | - |
| dc.contributor.author | 서일홍 | - |
| dc.date.accessioned | 2013-03-14T09:12:25Z | - |
| dc.date.available | 2013-03-14T09:12:25Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1988 | - |
| dc.identifier.citation | 한국자동제어학술회의, v., no., pp.353 - 359 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/107320 | - |
| dc.language | KOR | - |
| dc.title | 반도체 소자용 자동 Die Bonding System의 개발 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 353 | - |
| dc.citation.endingpage | 359 | - |
| dc.citation.publicationname | 한국자동제어학술회의 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 변증남 | - |
| dc.contributor.nonIdAuthor | 오상록 | - |
| dc.contributor.nonIdAuthor | 김재옥 | - |
| dc.contributor.nonIdAuthor | 안태영 | - |
| dc.contributor.nonIdAuthor | 유범재 | - |
| dc.contributor.nonIdAuthor | 서일홍 | - |
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