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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

반도체 소자용 자동 Die Bonder 기계장치의 개발Development of Die Bonder Machine for Semiconductor Automatic Assembly

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dc.contributor.author윤명중-
dc.contributor.author변증남-
dc.contributor.author오상록-
dc.contributor.author오영석-
dc.contributor.author서일홍-
dc.contributor.author안태영-
dc.contributor.author권구빈-
dc.contributor.author김제옥-
dc.contributor.author김정덕-
dc.date.accessioned2013-03-14T09:11:15Z-
dc.date.available2013-03-14T09:11:15Z-
dc.date.created2012-02-06-
dc.date.issued1987-
dc.identifier.citation1987년도 대한전기, 전자공학학술대회, v., no., pp.216 - 220-
dc.identifier.urihttp://hdl.handle.net/10203/107313-
dc.languageKOR-
dc.title반도체 소자용 자동 Die Bonder 기계장치의 개발-
dc.title.alternativeDevelopment of Die Bonder Machine for Semiconductor Automatic Assembly-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage216-
dc.citation.endingpage220-
dc.citation.publicationname1987년도 대한전기, 전자공학학술대회-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthor윤명중-
dc.contributor.localauthor변증남-
dc.contributor.nonIdAuthor오상록-
dc.contributor.nonIdAuthor오영석-
dc.contributor.nonIdAuthor서일홍-
dc.contributor.nonIdAuthor안태영-
dc.contributor.nonIdAuthor권구빈-
dc.contributor.nonIdAuthor김제옥-
dc.contributor.nonIdAuthor김정덕-
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EE-Conference Papers(학술회의논문)EE-Conference Papers(학술회의논문)
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