DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Seung-Woo | - |
dc.contributor.author | Park, S.H | - |
dc.contributor.author | Lee, C.W. | - |
dc.date.accessioned | 2013-03-14T09:07:17Z | - |
dc.date.available | 2013-03-14T09:07:17Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1994 | - |
dc.identifier.citation | Ultraprecision Manufacturing Engineering 3, v., no., pp.39 - 42 | - |
dc.identifier.uri | http://hdl.handle.net/10203/107286 | - |
dc.language | ENG | - |
dc.title | Design of an Ultraprecision Stepping Stage for Lithography of Next Generation Integrated-Circuit Chips | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 39 | - |
dc.citation.endingpage | 42 | - |
dc.citation.publicationname | Ultraprecision Manufacturing Engineering 3 | - |
dc.identifier.conferencecountry | Germany | - |
dc.identifier.conferencecountry | Germany | - |
dc.contributor.localauthor | Kim, Seung-Woo | - |
dc.contributor.nonIdAuthor | Park, S.H | - |
dc.contributor.nonIdAuthor | Lee, C.W. | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.