An Adhesion Study of Copper and Chromium Films to Polyimide
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | - |
| dc.date.accessioned | 2013-03-14T08:56:27Z | - |
| dc.date.available | 2013-03-14T08:56:27Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1994-10-01 | - |
| dc.identifier.citation | Mat. Res. Soc. Symp, v., no., pp.377 - 372 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/107214 | - |
| dc.language | ENG | - |
| dc.title | An Adhesion Study of Copper and Chromium Films to Polyimide | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 377 | - |
| dc.citation.endingpage | 372 | - |
| dc.citation.publicationname | Mat. Res. Soc. Symp | - |
| dc.contributor.localauthor | Yu, Jin | - |
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