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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Adhesion study of copper and chromium films to polyimide

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dc.contributor.authorChung, TG-
dc.contributor.authorYu, Jin-
dc.contributor.authorKim, YH-
dc.contributor.authorAhn, EC-
dc.contributor.authorPark, IS-
dc.date.accessioned2013-03-14T08:01:59Z-
dc.date.available2013-03-14T08:01:59Z-
dc.date.created2012-02-06-
dc.date.issued1993-11-29-
dc.identifier.citationProceedings of the Fall 1993 MRS Meeting, v.323, no., pp.377 - 382-
dc.identifier.issn0272-9172-
dc.identifier.urihttp://hdl.handle.net/10203/106800-
dc.languageENG-
dc.titleAdhesion study of copper and chromium films to polyimide-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0027927548-
dc.type.rimsCONF-
dc.citation.volume323-
dc.citation.beginningpage377-
dc.citation.endingpage382-
dc.citation.publicationnameProceedings of the Fall 1993 MRS Meeting-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorChung, TG-
dc.contributor.nonIdAuthorKim, YH-
dc.contributor.nonIdAuthorAhn, EC-
dc.contributor.nonIdAuthorPark, IS-
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MS-Conference Papers(학술회의논문)
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