DC Field | Value | Language |
---|---|---|
dc.contributor.author | 유진 | - |
dc.contributor.author | Kim, YH | - |
dc.contributor.author | Chung, DK | - |
dc.contributor.author | Im, JH | - |
dc.date.accessioned | 2013-03-14T04:33:16Z | - |
dc.date.available | 2013-03-14T04:33:16Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1993 | - |
dc.identifier.citation | Proc. 7th Conf. Materials and Materials Properties, v., no., pp.13 - 17 | - |
dc.identifier.uri | http://hdl.handle.net/10203/105292 | - |
dc.language | KOR | - |
dc.title | 전자 부품에서의 박막의 접착성 | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 13 | - |
dc.citation.endingpage | 17 | - |
dc.citation.publicationname | Proc. 7th Conf. Materials and Materials Properties | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | 유진 | - |
dc.contributor.nonIdAuthor | Kim, YH | - |
dc.contributor.nonIdAuthor | Chung, DK | - |
dc.contributor.nonIdAuthor | Im, JH | - |
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