Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Li, X | - |
| dc.contributor.author | Pecht, M | - |
| dc.contributor.author | Bernard, E | - |
| dc.date.accessioned | 2013-03-14T03:42:42Z | - |
| dc.date.available | 2013-03-14T03:42:42Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1993-10-01 | - |
| dc.identifier.citation | Proceeding of IEEE-CHMT VLSI packaging workshop, v., no., pp.11 - 13 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/104915 | - |
| dc.language | ENG | - |
| dc.title | Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 11 | - |
| dc.citation.endingpage | 13 | - |
| dc.citation.publicationname | Proceeding of IEEE-CHMT VLSI packaging workshop | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Li, X | - |
| dc.contributor.nonIdAuthor | Pecht, M | - |
| dc.contributor.nonIdAuthor | Bernard, E | - |
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