DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sim, Gidong | ko |
dc.contributor.author | Won, Sejeong | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.date.accessioned | 2013-03-12T21:42:26Z | - |
dc.date.available | 2013-03-12T21:42:26Z | - |
dc.date.created | 2012-12-31 | - |
dc.date.created | 2012-12-31 | - |
dc.date.issued | 2012-11 | - |
dc.identifier.citation | APPLIED PHYSICS LETTERS, v.101, no.19 | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.uri | http://hdl.handle.net/10203/103607 | - |
dc.description.abstract | Flexible electronics using nanoparticle (NP) printing has been highlighted as a key technology enabling eco-friendly, low-cost, and large-area fabrication. For NP-based printing to be used as a successive alternative to photolithography and vacuum deposition, stretchability and long term reliability must be considered. This paper reports the stretchability and fatigue behavior of 100 nm thick NP-based silver thin films printed on polyethylene-terephthalate substrate and compares it to films deposited by electron-beam evaporation. NP-based films show stretchability and fatigue life comparable to evaporated films with intergranular fracture as the dominant failure mechanism. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4766447] | - |
dc.language | English | - |
dc.publisher | AMER INST PHYSICS | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | DAMAGE FORMATION | - |
dc.subject | LENGTH-SCALE | - |
dc.subject | COPPER-FILMS | - |
dc.subject | ELECTRONICS | - |
dc.subject | NANOPARTICLES | - |
dc.subject | CIRCUITS | - |
dc.subject | STEEL | - |
dc.title | Tensile and fatigue behaviors of printed Ag thin films on flexible substrates | - |
dc.type | Article | - |
dc.identifier.wosid | 000311320100029 | - |
dc.identifier.scopusid | 2-s2.0-84869073605 | - |
dc.type.rims | ART | - |
dc.citation.volume | 101 | - |
dc.citation.issue | 19 | - |
dc.citation.publicationname | APPLIED PHYSICS LETTERS | - |
dc.identifier.doi | 10.1063/1.4766447 | - |
dc.contributor.localauthor | Sim, Gidong | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | DAMAGE FORMATION | - |
dc.subject.keywordPlus | LENGTH-SCALE | - |
dc.subject.keywordPlus | COPPER-FILMS | - |
dc.subject.keywordPlus | ELECTRONICS | - |
dc.subject.keywordPlus | NANOPARTICLES | - |
dc.subject.keywordPlus | CIRCUITS | - |
dc.subject.keywordPlus | STEEL | - |
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