Special Issue: High/Low Temperature Adhesive Bonding Technology
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Dai Gil | ko |
| dc.date.accessioned | 2013-03-12T21:41:32Z | - |
| dc.date.available | 2013-03-12T21:41:32Z | - |
| dc.date.created | 2012-10-29 | - |
| dc.date.created | 2012-10-29 | - |
| dc.date.issued | 2012 | - |
| dc.identifier.citation | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.26, no.7, pp.885 - 887 | - |
| dc.identifier.issn | 0169-4243 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/103604 | - |
| dc.language | English | - |
| dc.publisher | TAYLOR & FRANCIS LTD | - |
| dc.title | Special Issue: High/Low Temperature Adhesive Bonding Technology | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000306742400002 | - |
| dc.identifier.scopusid | 2-s2.0-84864672768 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 26 | - |
| dc.citation.issue | 7 | - |
| dc.citation.beginningpage | 885 | - |
| dc.citation.endingpage | 887 | - |
| dc.citation.publicationname | JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | - |
| dc.identifier.doi | 10.1163/156856111X620486 | - |
| dc.contributor.localauthor | Lee, Dai Gil | - |
| dc.type.journalArticle | Editorial Material | - |
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