Fracture Toughness Measurement of Adhesively Bonded Joints at Cryogenic Temperatures

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dc.contributor.authorYoon, Soon-Hoko
dc.contributor.authorKim, Jin-Gyuko
dc.contributor.authorHwang, Yun-Jeongko
dc.contributor.authorLee, Dai-Gilko
dc.date.accessioned2013-03-12T16:27:22Z-
dc.date.available2013-03-12T16:27:22Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2012-
dc.identifier.citationJOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.26, no.7, pp.987 - 1001-
dc.identifier.issn0169-4243-
dc.identifier.urihttp://hdl.handle.net/10203/102866-
dc.description.abstractA sharp initial crack tip is required for measuring the fracture toughness or energy release rate of adhesive joints, especially at cryogenic temperatures because a blunt initial crack tip in the adhesive may lead to a higher value of fracture toughness than a sharp initial crack tip. Although ASTM D3433 standard specifies how to measure the fracture toughness of adhesive layers in bonded joints, it does not state the way to generate crack tips. In this work, the fracture toughness of adhesive joints was measured at the cryogenic temperature of -150 degrees C with respect to the crack generation method and location of the initial crack, and compared to that at 25 degrees C. From the experimental results, it was concluded that an initial sharp crack tip should be generated in the adhesive region to measure accurately the energy release rate of the adhesively bonded joint. Also, the fracture toughness of the adhesive joint at the cryogenic temperature of -150 degrees C should be measured with respect to crack tip location. (C) Koninklijke Brill NV, Leiden, 2012-
dc.languageEnglish-
dc.publisherTAYLOR FRANCIS LTD-
dc.subjectTOUGHENED EPOXY ADHESIVE-
dc.subjectCOMPOSITE-
dc.subjectPROPAGATION-
dc.subjectIMPROVEMENT-
dc.titleFracture Toughness Measurement of Adhesively Bonded Joints at Cryogenic Temperatures-
dc.typeArticle-
dc.identifier.wosid000306742400008-
dc.identifier.scopusid2-s2.0-84864702354-
dc.type.rimsART-
dc.citation.volume26-
dc.citation.issue7-
dc.citation.beginningpage987-
dc.citation.endingpage1001-
dc.citation.publicationnameJOURNAL OF ADHESION SCIENCE AND TECHNOLOGY-
dc.identifier.doi10.1163/156856111X593676-
dc.contributor.localauthorLee, Dai-Gil-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorFracture toughness-
dc.subject.keywordAuthorcrack tip sharpness-
dc.subject.keywordAuthorcryogenic temperature-
dc.subject.keywordAuthorDCB adhesive joint-
dc.subject.keywordPlusTOUGHENED EPOXY ADHESIVE-
dc.subject.keywordPlusCOMPOSITE-
dc.subject.keywordPlusPROPAGATION-
dc.subject.keywordPlusIMPROVEMENT-
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