Direct stamping of silver nanoparticles toward residue-free thick electrode

Cited 29 time in webofscience Cited 0 time in scopus
  • Hit : 427
  • Download : 1131
Direct stamping of functional materials has been developed for cost-effective and process-effective manufacturing of nano/micro patterns. However, there remain several challenging issues like the perfect removal of the residual layer and realization of high aspect ratio. We have demonstrated facile fabrication of flexible strain sensors that have microscale thick interdigitated capacitors with no residual layer by a simple direct stamping with silver nanoparticles (AgNPs). Polyurethane (PU) prepolymer was utilized as an adhesive layer to transfer AgNPs more efficiently during the separation step of the flexible stamp from directly stamped AgNPs. Scanning electron microscopy images and energy dispersive x-ray spectroscopy analysis revealed residue-free transfer of microscale thick interdigitated electrodes onto two different flexible substrates (elastomeric and brittle) for the application to highly sensitive strain sensors.
Publisher
NATL INST MATERIALS SCIENCE
Issue Date
2012-06
Language
English
Article Type
Article
Keywords

FABRICATION; FILMS; DEPOSITION; SUBSTRATE; GOLD; INK

Citation

SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, v.13, no.3

ISSN
1468-6996
DOI
10.1088/1468-6996/13/3/035004
URI
http://hdl.handle.net/10203/102687
Appears in Collection
MS-Journal Papers(저널논문)
Files in This Item
000306492500005.pdf(1.55 MB)Download
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 29 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0