Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

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Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15x) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4706257]
Publisher
AMER INST PHYSICS
Issue Date
2012-04
Language
English
Article Type
Article
Keywords

SURFACES; SEMITRANSPARENT; ELECTRONICS; TRANSISTORS

Citation

APPLIED PHYSICS LETTERS, v.100, no.17

ISSN
0003-6951
DOI
10.1063/1.4706257
URI
http://hdl.handle.net/10203/102622
Appears in Collection
CBE-Journal Papers(저널논문)
Files in This Item
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