Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals

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Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form of delamination and cracking of the films, which has not been investigated quantitatively or systematically. Here, we directly measured the interfacial fracture energy of silver nanoparticle thin films by using double cantilever beam fracture mechanics testing. It was demonstrated that the thermal annealing temperature and period affect the interfacial fracture energy. Also it was found that the interfacial fracture resistance can be maximized with optimized annealing conditions by the formation of organic residual bridges during the annealing process.
Publisher
IOP PUBLISHING LTD
Issue Date
2012-12
Language
English
Article Type
Article
Citation

NANOTECHNOLOGY, v.23, no.48

ISSN
0957-4484
DOI
10.1088/0957-4484/23/48/485704
URI
http://hdl.handle.net/10203/102542
Appears in Collection
ME-Journal Papers(저널논문)
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