Physico-chemical characteristics of high performance polymer modified by low and atmospheric pressure plasma

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dc.contributor.authorBhatnagar, Nituko
dc.contributor.authorJha, Sangeetako
dc.contributor.authorBhowmik, Shantanuko
dc.contributor.authorGupta, Govindko
dc.contributor.authorMoon, Jin-Bumko
dc.contributor.authorKim, Chun-Gonko
dc.date.accessioned2013-03-12T12:43:18Z-
dc.date.available2013-03-12T12:43:18Z-
dc.date.created2012-08-08-
dc.date.created2012-08-08-
dc.date.issued2012-03-
dc.identifier.citationSURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY, v.48, no.2, pp.117 - 126-
dc.identifier.issn1068-3755-
dc.identifier.urihttp://hdl.handle.net/10203/102361-
dc.description.abstractIn this work, the effect of low pressure plasma and atmospheric-pressure plasma treatment on surface properties and adhesion characteristics of high performance polymer, Polyether Ether Ketone (PEEK) are investigated in terms of Fourier Transform Infrared Spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and Atomic Force Microscopy (AFM). The experimental results show that the PEEK surface treated by atmospheric pressure plasma lead to an increase in the polar component of the surface energy, resulting in improving the adhesion characteristics of the PEEK/Epoxy adhesive system. Also, the roughness of the treated surfaces is largely increased as confirmed by AFM observation. These results can be explained by the fact that the atmospheric pressure plasma treatment of PEEK surface yields several oxygen functionalities on hydrophobic surface, which play an important role in increasing the surface polarity, wettability, and the adhesion characteristics of the PEEK/Epoxy adhesive system.-
dc.languageEnglish-
dc.publisherALLERTON PRESS INC-
dc.subjectSURFACE MODIFICATION-
dc.subjectOXYGEN PLASMA-
dc.subjectFILMS-
dc.subjectPOLYIMIDE-
dc.titlePhysico-chemical characteristics of high performance polymer modified by low and atmospheric pressure plasma-
dc.typeArticle-
dc.identifier.wosid000304445200004-
dc.identifier.scopusid2-s2.0-84861500950-
dc.type.rimsART-
dc.citation.volume48-
dc.citation.issue2-
dc.citation.beginningpage117-
dc.citation.endingpage126-
dc.citation.publicationnameSURFACE ENGINEERING AND APPLIED ELECTROCHEMISTRY-
dc.identifier.doi10.3103/S1068375512020032-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Chun-Gon-
dc.contributor.nonIdAuthorBhatnagar, Nitu-
dc.contributor.nonIdAuthorJha, Sangeeta-
dc.contributor.nonIdAuthorBhowmik, Shantanu-
dc.contributor.nonIdAuthorGupta, Govind-
dc.type.journalArticleArticle-
dc.subject.keywordPlusSURFACE MODIFICATION-
dc.subject.keywordPlusOXYGEN PLASMA-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusPOLYIMIDE-
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