Multiproduct Lot Merging-Splitting Algorithms for Semiconductor Wafer Fabrication

Cited 4 time in webofscience Cited 0 time in scopus
  • Hit : 487
  • Download : 0
This paper focuses on a lot merging-splitting problem in a semiconductor wafer fabrication facility in which a relatively large number of wafer types are produced according to orders with different due dates. In the fab, two or more lots can be merged into a single lot if routes and all processing conditions of the lots are the same for a number of subsequent operations, and the merged lot is split into the original lots at the point where the routes or processing conditions become different. We suggest lot merging-splitting algorithms to reduce the total tardiness of the orders and the cycle times of the lots. The suggested algorithms are evaluated through a series of simulation experiments and the result shows that the algorithms work better than a method used in a real fab.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2012-05
Language
English
Article Type
Article
Keywords

MULTIPLE-ORDERS; DIFFUSION/OXIDATION PROCESSES; JOB; FACILITY; SIMULATION; MACHINES; RELEASE; RULE

Citation

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.25, no.2, pp.200 - 210

ISSN
0894-6507
DOI
10.1109/TSM.2012.2189784
URI
http://hdl.handle.net/10203/101820
Appears in Collection
IE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 4 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0