DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, JS | ko |
dc.contributor.author | Huh, Hoon | ko |
dc.date.accessioned | 2013-03-11T22:17:35Z | - |
dc.date.available | 2013-03-11T22:17:35Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-07 | - |
dc.identifier.citation | EXPERIMENTAL MECHANICS, v.51, no.6, pp.845 - 855 | - |
dc.identifier.issn | 0014-4851 | - |
dc.identifier.uri | http://hdl.handle.net/10203/100470 | - |
dc.description.abstract | The material properties of an oxygen-free high thermal conductivity (OFHC) film with a thickness of 0.1 mm were evaluated at strain rates ranging from 10(-3)/s to 10(3)/s using a high-speed material micro-testing machine (HSMMTM). The high strain-rate material properties of thin films are important especially for an evaluation of the structural reliability of micro-formed parts and MEMS products. The high strain-rate material testing methods of thin films, however, have yet to be established to the point that the testing methods of larger specimens for electronics, auto-body, train, ship, and ocean structures are. For evaluation, a new type of HSMMTM was developed to conduct high-speed tensile tests of thin films. This machine is capable of testing at a sufficiently high tensile speed with an electromagnetic actuator, a novel gripping mechanism, and an accurate load measurement system. The OFHC copper film shows high strain-rate sensitivity in terms of the flow stress, fracture elongation, and strain hardening. These measures increase as the tensile strain rate increases. The rate-dependent material properties of an OFHC copper film are also compared with those of a bulk OFHC copper sheet with a thickness of 1 mm. The flow stress of an OFHC copper film is relatively low compared to that of a bulk OFHC copper sheet in the entire range of strain rates, while the fracture elongation of an OFHC copper film is much larger than that of a bulk OFHC copper sheet. A quantitative comparison would provide material data at high strain rates for the design and analysis of micro-appliances and different types of micro-equipment. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | TENSILE PROPERTIES | - |
dc.subject | RATE SENSITIVITY | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | ESPI TECHNIQUE | - |
dc.subject | STEEL SHEETS | - |
dc.subject | BEHAVIOR | - |
dc.subject | STRESS | - |
dc.subject | NICKEL | - |
dc.subject | NI | - |
dc.title | Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine | - |
dc.type | Article | - |
dc.identifier.wosid | 000291255000004 | - |
dc.identifier.scopusid | 2-s2.0-79957920193 | - |
dc.type.rims | ART | - |
dc.citation.volume | 51 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 845 | - |
dc.citation.endingpage | 855 | - |
dc.citation.publicationname | EXPERIMENTAL MECHANICS | - |
dc.contributor.localauthor | Huh, Hoon | - |
dc.contributor.nonIdAuthor | Kim, JS | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Thin film | - |
dc.subject.keywordAuthor | OFHC copper | - |
dc.subject.keywordAuthor | Rate-dependent material properties | - |
dc.subject.keywordAuthor | Fracture elongation | - |
dc.subject.keywordAuthor | Microtesting machine | - |
dc.subject.keywordPlus | TENSILE PROPERTIES | - |
dc.subject.keywordPlus | RATE SENSITIVITY | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | ESPI TECHNIQUE | - |
dc.subject.keywordPlus | STEEL SHEETS | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | STRESS | - |
dc.subject.keywordPlus | NICKEL | - |
dc.subject.keywordPlus | NI | - |
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