Evaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine

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dc.contributor.authorKim, JSko
dc.contributor.authorHuh, Hoonko
dc.date.accessioned2013-03-11T22:17:35Z-
dc.date.available2013-03-11T22:17:35Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-07-
dc.identifier.citationEXPERIMENTAL MECHANICS, v.51, no.6, pp.845 - 855-
dc.identifier.issn0014-4851-
dc.identifier.urihttp://hdl.handle.net/10203/100470-
dc.description.abstractThe material properties of an oxygen-free high thermal conductivity (OFHC) film with a thickness of 0.1 mm were evaluated at strain rates ranging from 10(-3)/s to 10(3)/s using a high-speed material micro-testing machine (HSMMTM). The high strain-rate material properties of thin films are important especially for an evaluation of the structural reliability of micro-formed parts and MEMS products. The high strain-rate material testing methods of thin films, however, have yet to be established to the point that the testing methods of larger specimens for electronics, auto-body, train, ship, and ocean structures are. For evaluation, a new type of HSMMTM was developed to conduct high-speed tensile tests of thin films. This machine is capable of testing at a sufficiently high tensile speed with an electromagnetic actuator, a novel gripping mechanism, and an accurate load measurement system. The OFHC copper film shows high strain-rate sensitivity in terms of the flow stress, fracture elongation, and strain hardening. These measures increase as the tensile strain rate increases. The rate-dependent material properties of an OFHC copper film are also compared with those of a bulk OFHC copper sheet with a thickness of 1 mm. The flow stress of an OFHC copper film is relatively low compared to that of a bulk OFHC copper sheet in the entire range of strain rates, while the fracture elongation of an OFHC copper film is much larger than that of a bulk OFHC copper sheet. A quantitative comparison would provide material data at high strain rates for the design and analysis of micro-appliances and different types of micro-equipment.-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.subjectTENSILE PROPERTIES-
dc.subjectRATE SENSITIVITY-
dc.subjectMECHANICAL-PROPERTIES-
dc.subjectESPI TECHNIQUE-
dc.subjectSTEEL SHEETS-
dc.subjectBEHAVIOR-
dc.subjectSTRESS-
dc.subjectNICKEL-
dc.subjectNI-
dc.titleEvaluation of the Material Properties of an OFHC Copper Film at High Strain Rates Using a Micro-Testing Machine-
dc.typeArticle-
dc.identifier.wosid000291255000004-
dc.identifier.scopusid2-s2.0-79957920193-
dc.type.rimsART-
dc.citation.volume51-
dc.citation.issue6-
dc.citation.beginningpage845-
dc.citation.endingpage855-
dc.citation.publicationnameEXPERIMENTAL MECHANICS-
dc.contributor.localauthorHuh, Hoon-
dc.contributor.nonIdAuthorKim, JS-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorThin film-
dc.subject.keywordAuthorOFHC copper-
dc.subject.keywordAuthorRate-dependent material properties-
dc.subject.keywordAuthorFracture elongation-
dc.subject.keywordAuthorMicrotesting machine-
dc.subject.keywordPlusTENSILE PROPERTIES-
dc.subject.keywordPlusRATE SENSITIVITY-
dc.subject.keywordPlusMECHANICAL-PROPERTIES-
dc.subject.keywordPlusESPI TECHNIQUE-
dc.subject.keywordPlusSTEEL SHEETS-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordPlusSTRESS-
dc.subject.keywordPlusNICKEL-
dc.subject.keywordPlusNI-
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