Theoretical investigations on multiple-reflection and Rayleigh absorption-emission-scattering effects in laser drilling

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A fundamental study of laser drilling was performed with computational analysis. High power Q-switched diode-pumped laser drilling simulations were conducted on N-type silicon wafers. In the numerical model, the volume of fluid method was adopted to trace the free surface of the drilled-hole with the governing equations including continuity, momentum, and energy equation. The laser beam was considered as a surface heat flux with near-Gaussian distribution. The simulation model took into account the physical phenomena, taking place during drilling of the silicon wafer, such as the effects of recoil pressure producing a narrow and deep profile, Fresnel absorption transferring the energy from laser beam to workpiece, multiple-reflection raising the absorption of laser energy, and Rayleigh absorption-emission-scattering absorbing and distributing the entrance laser energy. In particular, a novel model for laser drilling was proposed from the view point of the transmitted, absorbed, emitted, and scattered light. (C) 2009 Elsevier B. V. All rights reserved.
Publisher
ELSEVIER SCIENCE BV
Issue Date
2010-02
Language
English
Article Type
Article
Keywords

SILICON; ABLATION; PLASMA; DYNAMICS; ND

Citation

APPLIED SURFACE SCIENCE, v.256, no.8, pp.2392 - 2399

ISSN
0169-4332
DOI
10.1016/j.apsusc.2009.10.073
URI
http://hdl.handle.net/10203/100235
Appears in Collection
ME-Journal Papers(저널논문)
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