Browse by Type Conference

Showing results 59361 to 59380 of 109410

59361
Noise Analysis and Optimization of Vanadium Pentoxide(V2O5)-Based Highly Sensitive Thermistor

채민호; 이원희, 2020년 한국물리학회 가을학술논문발표회, 한국물리학회, 2020-11-06

59362
Noise analysis of a wavelength-locked Fabry-Perot laser diode

Park, K.-Y.; Lee, Chang-Hee, 2008 7th International Conference on the Optical Internet, COIN 2008, pp.1 - 2, 2008-10-14

59363
Noise analysis of cylindrical roller bearings

Rho B.-H.; Kim D.-G.; Kim, Kyung-Woong, 2004 ASME/STLE International Joint Tribology Conference, pp.765 - 770, 2004-10-24

59364
Noise and Gain Optimization Technique for RF Integrated CMOS Low Noise Amplifier

Lee, Sang-Gug, IEEE International Conference on Electronic Devices and Solid-State Circuits, v.0, no.0, pp.221 - 224, IEEE International Conference on Electronic Devices and Solid-State Circuits, 2003-12-01

59365
Noise and Interference Characterization for MLC Flash Memories

Moon, Jaekyun; No, J.; Lee, S.; Kim, S.; Yang, J.; Chang, S., International Conference on Computing, Networking and Communications 2012, IEEE, 2012-01-30

59366
Noise and Vibration Characteristics of Externally Pressurized Slot-Restricted Air Journal Bearings

Rho, BH; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2003-10-26

59367
Noise and Vibration Phenomena of On-Line Electric Vehicle

Shin, Eun-Gyeong; Ahlswede, Michael; Muenzberg, Christopher; Suh, In-Soo; Engel, Ferhat, SAE 2011 Noise and Vibration Conference and Exhibition, SAE, 2011-04

59368
Noise aware depth denoising for a time-of-flight camera

Kweon, In-So; Jung, Jiyoung; Lee, Joon Young, 20th Korea-Japan Joint Workshop on Frontiers of Computer Vision, Asian Federation of Computer Vision (AFCV), 2014-02-05

59369
Noise bandwidth suppression circuit for low noise IRFPA

Kim, B.; Kang, S.-G.; Lee, Hee Chul; Kim, C.-K., Infrared Technology and Applications XXVIII, v.4820, no.1, pp.327 - 333, 2002-07-07

59370
Noise cancelling with autoassociative memory trained by order statistics

Bae, J; Ryu, Y; Song, Iickho, Proceedings of the 1994 IEEE International Conference on Neural Networks. Part 1 (of 7), v.5, pp.3431 - 3436, 1994-06-27

59371
Noise Capacitive Sensor for Multi-Touch Mobile Handset's Applications

Ko, S.; Shin, H.; Lee, J.; Jang, H.; So, B.-C.; Yun, I.; Lee, Kwyro, IEEE ASIAN SOLID-STATE CIRCUITS CONF., pp.113 - 116, IEEE, 2009-12

59372
Noise Characteristics of Contra-Rotating Open Rotor with Time-Spectral CFD and Aeroacoustics Analysis

Yi, Seulgi; Kwon, Hyungil; Im, Dong Kyun; Choi, Seongim; Lee, Duck Joo, AIAA SciTech 2016, AMER INST AERONAUT ASTRONAUT, 2016-01-06

59373
Noise Characteristics of Pile Driving Operation and Design of a Low-Noise Pile Cap Based on the Scale Model Experiment

Ih, Jeong-Guon, Inter-Noise 2003, pp.0 - 0, 2003-08-01

59374
Noise control of zones: its theory and applications

Jin-Young Park; Min-Ho Song; Jung-Min Lee; Tae-Woong Lee; Ji-Ho Chang; Kim, Yang-Hann, InterNoise 2010, Institute of Noise Control Engineering, 2010-06-16

59375
Noise Coupling Analysis between TSV and Active Circuit

Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

59376
Noise coupling analysis method for an electronic safety and arming device (ESAD)

Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12

59377
Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC

Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17

59378
Noise coupling emulation between TSV and active circuit through metal oxide patch

Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28

59379
Noise Coupling Modeling and Analysis of Through Glass Via(TGV)

Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31

59380
Noise Coupling of Through-Via in Silicon and Glass Interposer

Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29

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